Power Modules Services

Power Modules Services

"IMI power module division offers a broad packaging solution for all requirements in power electronics world ".

IMI is a powerhouse among power module manufacturers. We offer custom as well as standard design platform packages to meet your needs.

Design Capabilities/Expertise

  • Modeling
  • Open Source Packages (Can Speed up the Designtime)
  • Simulation
    • Thermal
    • Parasitic component
    • Thermal impedance measurement
    • Thermo-Mechanical
    • Fluid flow simulation
  • Layout
    • DBC
    • Bonding
    • POD (Package Outline Drawing)
  • Material selection using appropriate technology
  • Insulation test and characterization test
  • AEC-Q101 certification for automotive using IMI’s Reliability lab

Technology Capabilities/Expertise

  • Die Sawing (Si, SiC)
  • Substrate:
    • DBC: AI203, AMB, ALN
    • IMS
  • Die/substrate attach:
    • Solder paste & preform (Pb and Pb free) / Voids rate control
    • Sintering (Pressure less and assisted
  • Baseplate: warpage control, pre-TIM, Pin Fin
    • Copper
    • AISiC
  • Interconnection: AI wire, Cu/AICu wires, Gold wire, Ribbon, Lead frame, Cu clip, US welding
  • Protection: silicone gel, epoxy potting, transfer molding
  • Test & Reliability:
    • All kinds of standard (Static and Dynamic) test cold and hot
    • Reliability up to Automotive
    • UL certification possibility
  • Full tracebility:
    • Material Main item i.e. Substrate, Leadframe, Baseplate and Dietracing.
    • Date Code

Power Module Virtual Prototyping

  • Power Module Analysis Before Prototyping
  • Electrical and Electromagnetic Simulation
  • Thermal Simulation
  • Fluid Flow Simulation
  • Thermo-Mechanical Simulation

Process Capabilities/Expertise

  • Water sawing
  • Molded DBC (epoxy)
  • Copper lead frame, US welding
  • Silicone gel
  • COB (wire, clip bonding)
  • Sintering (no reflow but assembly by sintering)

Assembly and Production

  • Die attach soldering
  • Baseplate attach soldering
  • Top Side connection (ribbon branding, dip)

End-of-Line tests

  • Static Tester
  • Dynamic Tester
  • Insulation Tester
  • Mechanical Measurement

Benefits of IMI’s Power Module Services:

  • Time-to-Market: Use IMI’s Proven Power Module Platforms and save 12-36 monthsof design and development time.
  • Potential Cost Improvement
    • Technical Human resource
    • Puchasing Power
    • Virtual Prototype
    • Prototype Line. Reduce Errors before Mass Production
    • Open Package for reduced tooling Cost
    • Free Trading Zone
  • Improved Quality and Reliability: IMI goes through rigorous tests and simulations to improve IMI’s power module quality and reliability.
  • IMI Does not Compete with Our Customers!

Move your production to imi today!

Visit Main Website © 2019 Integrated Micro-Electronics. All Rights Reserved.